Invention Grant
- Patent Title: High-speed transmission connector
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Application No.: US17570424Application Date: 2022-01-07
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Publication No.: US11967785B2Publication Date: 2024-04-23
- Inventor: Yoshiharu Ishii , Toshiyasu Ito
- Applicant: Yamaichi Electronics Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: YAMAICHI ELECTRONICS CO., LTD.
- Current Assignee: YAMAICHI ELECTRONICS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Hayes Soloway PC
- Priority: CN 2110039032.2 2021.01.12
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H01R24/60 ; H01R107/00

Abstract:
A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.
Public/Granted literature
- US20220224040A1 HIGH-SPEED TRANSMISSION CONNECTOR Public/Granted day:2022-07-14
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