Invention Grant
- Patent Title: Stretchable substrate having improved stretch uniformity and method of manufacturing the same
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Application No.: US17703520Application Date: 2022-03-24
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Publication No.: US11968778B2Publication Date: 2024-04-23
- Inventor: Phillip Lee , SeungJun Chung , HeeSuk Kim , JeongGon Son , SukJoon Hwang
- Applicant: Korea Institute of Science and Technology
- Applicant Address: KR Seoul
- Assignee: Korea Institute of Science and Technology
- Current Assignee: Korea Institute of Science and Technology
- Current Assignee Address: KR Seoul
- Agency: Studebaker & Brackett PC
- Priority: KR 20210193784 2021.12.31
- Main IPC: H05K1/02
- IPC: H05K1/02 ; A41D1/00 ; A41D1/06 ; A41D13/00 ; A41D13/05 ; A42B1/041 ; A42B1/08 ; A42B1/22 ; A43B23/28 ; B32B38/08 ; H05K1/03 ; H05K3/00
Abstract:
Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.
Public/Granted literature
- US20230217588A1 STRETCHABLE SUBSTRATE HAVING IMPROVED STRETCH UNIFORMITY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-07-06
Information query
