Invention Grant
- Patent Title: Wireless communication board and electronic device having same
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Application No.: US17653601Application Date: 2022-03-04
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Publication No.: US11968783B2Publication Date: 2024-04-23
- Inventor: Jongwon Park , Jaegeun Son , Jaechan Lee , Sunil Jin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20190110905 2019.09.06
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01R12/52 ; H01R12/57 ; H01R12/70 ; H01R31/06 ; H05K1/11 ; H01R12/72 ; H01R12/75

Abstract:
A wireless communication board comprises: a communication board; a wireless communication part disposed on the communication board; a power supply provided on the communication board and configured to supply a power source to the wireless communication part; a surface mounting pad that is connected to the wireless communication part and power supply and disposed on a main board by means of the surface mounting technology; and a wire connection connected to the wireless communication part and power supply and connected to the main board by means of a wire, wherein the main board comprises a main processor for controlling the operation of an electronic device.
Public/Granted literature
- US20220192023A1 WIRELESS COMMUNICATION BOARD AND ELECTRONIC DEVICE HAVING SAME Public/Granted day:2022-06-16
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