Invention Grant
- Patent Title: Flux and solder paste
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Application No.: US17423926Application Date: 2020-01-23
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Publication No.: US11975411B2Publication Date: 2024-05-07
- Inventor: Kazuhiro Yukikata , Noriyoshi Uchida
- Applicant: KOKI Company Limited
- Applicant Address: JP Tokyo
- Assignee: KOKI Company Limited
- Current Assignee: KOKI Company Limited
- Current Assignee Address: JP Tokyo
- Agency: Clark & Brody LP
- Priority: JP 19010154 2019.01.24
- International Application: PCT/JP2020/002252 2020.01.23
- International Announcement: WO2020/153418A 2020.07.30
- Date entered country: 2021-07-19
- Main IPC: B23K35/00
- IPC: B23K35/00 ; B23K35/02 ; B23K35/362 ; C22C13/00
Abstract:
A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.
Public/Granted literature
- US20220009042A1 FLUX AND SOLDER PASTE Public/Granted day:2022-01-13
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