Invention Grant
- Patent Title: Thermal transfer sheet
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Application No.: US17593872Application Date: 2020-03-25
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Publication No.: US11975554B2Publication Date: 2024-05-07
- Inventor: Hiroto Matsui
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: BURR PATENT LAW, PLLC
- Priority: JP 19072338 2019.04.04
- International Application: PCT/JP2020/013380 2020.03.25
- International Announcement: WO2020/203566A 2020.10.08
- Date entered country: 2021-09-27
- Main IPC: B41M5/44
- IPC: B41M5/44

Abstract:
Provided is a thermal transfer sheet enabling printing suitability on high temperature printing to be good. A thermal transfer sheet 100 in which either one or both of a colorant layer 3 and a transfer layer 10 are provided on one face of a substrate 1, and a back face layer 20 is provided on the other face of the substrate 1, wherein a back face primer layer 25 is provided between the substrate 1 and the back face layer 20, and the back face primer layer 25 contains at least one component selected from a silicone resin, a siloxane cross-linked resin, and a silica-introduced resin.
Public/Granted literature
- US20220144001A1 THERMAL TRANSFER SHEET Public/Granted day:2022-05-12
Information query
IPC分类: