Invention Grant
- Patent Title: Cushioning material, packing material, and packed goods
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Application No.: US18053007Application Date: 2022-11-07
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Publication No.: US11975906B2Publication Date: 2024-05-07
- Inventor: Shinya Kamigaki , Sanshiro Takeshita , Haoki Fushimi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: WORKMAN NYDEGGER
- Priority: JP 21182458 2021.11.09
- Main IPC: B65D81/05
- IPC: B65D81/05 ; B65D85/68

Abstract:
Provided is a cushioning material for being put into a packing box configured for encasement of electronic equipment. The cushioning material absorbs external stress applied to the electronic equipment encased in the packing box. The cushioning material includes: a first holder including a first plate configured to face the electronic equipment when the cushioning material and the electronic equipment are encased in the packing box, and a second plate configured to face an inner wall surface of the packing box when the cushioning material and the electronic equipment are encased in the packing box; and a first cushioning block provided between the first plate and the second plate.
Public/Granted literature
- US20230141442A1 CUSHIONING MATERIAL, PACKING MATERIAL, AND PACKED GOODS Public/Granted day:2023-05-11
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