Invention Grant
- Patent Title: Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board
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Application No.: US18031734Application Date: 2021-10-01
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Publication No.: US11976171B2Publication Date: 2024-05-07
- Inventor: Yoshinori Sato , Hiroyuki Matsuyama , Yoshihiko Konno
- Applicant: Arisawa MFG. Co., Ltd.
- Applicant Address: JP Niigata
- Assignee: Arisawa MFG. Co., Ltd.
- Current Assignee: Arisawa MFG. Co., Ltd.
- Current Assignee Address: JP Niigata
- Agency: Maschoff Brennan
- Agent Yuefen Zhou
- Priority: JP 20177202 2020.10.22
- International Application: PCT/JP2021/036515 2021.10.01
- International Announcement: WO2022/085398A 2022.04.28
- Date entered country: 2023-04-13
- Main IPC: C08G73/10
- IPC: C08G73/10 ; H05K1/03

Abstract:
A polyimide resin precursor is obtained by allowing a diamine and an acid anhydride to react with each other. The diamine includes p-phenylenediamine, a bis(aminophenoxy)benzene, and 2-(4-aminophenyl)benzoxazol-5-amine. The acid anhydride includes a biphenyl tetracarboxylic dianhydride. The content of the p-phenylenediamine is 30 to 75% by mol, the content of the bis(aminophenoxy)benzene is 10 to 30% by mol, and the content of the 2-(4-aminophenyl)benzoxazol-5-amine is 10 to 50% by mol, with respect to the total of the diamine. The content of the biphenyl tetracarboxylic dianhydride is 78% by mol or more with respect to the total of the acid anhydride.
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