Invention Grant
- Patent Title: Polishing composition and method for producing same
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Application No.: US17870663Application Date: 2022-07-21
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Publication No.: US11976220B2Publication Date: 2024-05-07
- Inventor: Kohsuke Tsuchiya , Hisanori Tansho , Yusuke Suga , Taiki Ichitsubo , Takayuki Takemoto , Naohiko Saito , Michihiro Kaai
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu
- Agency: FOLEY & LARDNER LLP
- Priority: JP 17214204 2017.11.06
- The original application number of the division: US16761302
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; H01L21/306
Abstract:
Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
Public/Granted literature
- US20230073290A1 POLISHING COMPOSITION AND METHOD FOR PRODUCING SAME Public/Granted day:2023-03-09
Information query
