Invention Grant
- Patent Title: Universal thermoplastic adhesives for multilayer films
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Application No.: US17255541Application Date: 2019-06-26
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Publication No.: US11976221B2Publication Date: 2024-05-07
- Inventor: Camille Olry , Karlheinz Hausmann , I-Hwa Lee
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Dinsmore & Shohl LLP
- Priority: EP 305862 2018.07.02
- International Application: PCT/US2019/039182 2019.06.26
- International Announcement: WO2020/009854A 2020.01.09
- Date entered country: 2020-12-23
- Main IPC: C09J123/06
- IPC: C09J123/06 ; B32B7/12 ; B32B27/08 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; C09J123/08 ; C09J133/06

Abstract:
Embodiments of the present disclosure are directed to a thermoplastic adhesive composition comprising: at least one maleic anhydride-grafted ethylene-based polymer; at least one at least one ethylene/α-olefin/non-conjugated diene interpolymer having a molecular weight distribution (MWD) ≥2.5, wherein MWD=Mw/Mn, wherein Mw is weight averaged molecular weight and Mn is number averaged molecular weight, which are both determined by gel permeation chromatography; a very low density polyethylene (VLDPE) having a density in the range 0.885 to 0.915 grams/cm3; and optionally at least one ethylene alkyl (meth)acrylate copolymer, wherein the alkyl group comprises one to four carbon atoms.
Public/Granted literature
- US20210371712A1 UNIVERSAL THERMOPLASTIC ADHESIVES FOR MULTILAYER FILMS Public/Granted day:2021-12-02
Information query
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