A deposition mask according to an embodiment includes a metal plate including a first surface and a second surface opposite to the first surface wherein the metal plate includes iron (Fe) and nickel (Ni), a thickness of the metal plate is 15 μm to 30 μm, and the metal plate includes a first surface layer having a depth of 20% or less of the thickness of the metal plate from the first surface and a second surface layer having a depth of 20% or less of the thickness of the metal plate from the second surface, wherein when diffraction intensity with respect to a (111) crystal plane of the first surface layer is defined as I (111), diffraction intensity with respect to a (200) crystal plane is defined as I (200), and diffraction intensity with respect to a (220) crystal plane is defined as I (220), a ratio of diffraction intensity of I (220) is defined by Equation 1 below,

A=I(220)/(I(200)+I(220)+I(111))  [Equation]



a ratio of diffraction intensity of I (200) is defined by Equation 2 below,

B=I(200)/(I(200)+I(220)+I(111))  [Equation 2]

a ratio of diffraction intensity of I (111) is defined by Equation 3 below,

C=I(111)/(I(200)+I(220)+I(111))  [Equation 3]

a value of the A is greater than a value of the B and a value of the C, the value of the B is greater than the value of the C, and when a ratio of the B to the A (B/A) is defined as D, a value of the D is 0.5 to less than 1.