Invention Grant
- Patent Title: Connection assembly, levelling or lifting system, and method of levelling a slab
-
Application No.: US17432770Application Date: 2020-02-12
-
Publication No.: US11976427B2Publication Date: 2024-05-07
- Inventor: Nen Nguyendinh , Oscar Augusto Cesar Amestegui Aguilar , Ali Aryo Bawono , Bernhard Lechner
- Applicant: NANYANG TECHNOLOGICAL UNIVERSITY , TUM CREATE LIMITED
- Applicant Address: SG Singapore
- Assignee: NANYANG TECHNOLOGICAL UNIVERSITY,TUM CREATE LIMITED
- Current Assignee: NANYANG TECHNOLOGICAL UNIVERSITY,TUM CREATE LIMITED
- Current Assignee Address: SG Singapore; SG Singapore
- Agency: Seed IP Law Group LLP
- Priority: SG 201901575W 2019.02.22
- International Application: PCT/SG2020/050068 2020.02.12
- International Announcement: WO2020/171775A 2020.08.27
- Date entered country: 2021-08-20
- Main IPC: E01C23/10
- IPC: E01C23/10 ; E04G21/10 ; E04G21/14

Abstract:
A connection assembly for connecting a bolt to a slab includes a first connection part and a second connection part. The first connection part and the second connection part may be capable of being assembled to the slab in a manner so as to sandwich the slab with a first clamping member of the first connection part and a second clamping member of the second connection part between two opposite surfaces of the slab. The first connection part and the second connection part may be connected in a manner such that a connection between a first hollow-tubular-connecting-structure of the first connection part and a second hollow-tubular-connecting-structure of the second connection part may be within a through-hole in the slab, which extends between the two opposite surfaces of the slab.
Public/Granted literature
- US20220145553A1 CONNECTION ASSEMBLY, LEVELLING OR LIFTING SYSTEM, AND METHOD OF LEVELLING A SLAB Public/Granted day:2022-05-12
Information query
IPC分类: