A module, including at least one first component in the form of a semiconductor component including multiple stress measuring cells situated in a distributed manner for detecting stress measured values at different measuring positions of the semiconductor component, at least one second component which is mechanically coupled to the semiconductor component, and an evaluation unit, which is designed to ascertain at least one location-dependent stress distribution in the semiconductor component based on the stress measured values detected at one measuring point in time, and to ascertain a deformation state of the at least one second component at the measuring point in time on the basis of the at least one ascertained location-dependent stress distribution in the semiconductor component. A corresponding method for monitoring environmental influences on a module is also described.