A pull out-assisting linkage device for load board of semiconductor automatic test equipment. One end of the handle is rotatably connected to the test equipment by a rotating member. The middle of the handle is bolted to the linkage. The two rotating plates are fixedly connected to the linkage and are located at the two ends of the linkage. Each rotating plate is rotatably connected to the test equipment. Both the first pull out-assisting rod and the second pull out-assisting rod are fixedly connected to each rotating plate by a universal connecting rod. The first pull out-assisting rod and the second pull out-assisting rod are slidingly connected to the test equipment. The first pull out-assisting rod has a first pull out-assisting slot in the side wall, and the second pull out-assisting rod has a second pull out-assisting slot in the side wall, with the first pull out-assisting slot and the second pull out-assisting slot set in reverse. The present invention makes the pull out-assisting device more accurate in propulsion distance, simple in structure, and low in investment cost.