Methods, systems, and devices for on-die termination configuration for a memory device are described. In some examples, a memory device may determine a connection option from a set of connections options for which an ODT pin of the memory device is configured. Each connection option may correspond to a termination configuration for a different pin, such as a command and address (CA) pin, a clock (CK) pin, or a chip select (CS). Based on the determined connection option, the memory device may identify a respective termination option for each of the different pins, such as a first termination option for the CA pin, a second termination option for the CK pin, and a third termination option for the CS pin, and configure each of the different pins according to the respective termination option for that pin.