Invention Grant
- Patent Title: Firmware power up sequencing in memory sub-systems
-
Application No.: US17877406Application Date: 2022-07-29
-
Publication No.: US11977755B2Publication Date: 2024-05-07
- Inventor: Ximin Shan , Venkata Naga Lakshman Pasala , Noorshaheen Mavungal Noorudheen
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Priority: IN 2141039774 2021.09.02
- Main IPC: G06F3/06
- IPC: G06F3/06

Abstract:
A front-end firmware component of a memory sub-system receives a first request to perform a first set of initialization operations and initiates a first set of initialization operations for the front-end component in parallel with initiating a second set of initialization operations for a back-end component. Responsive to completing the first set of initialization operations, the front-end component sends a first notification to a host computer system to indicate that the front-end component is available to respond to requests for configuration data associated with the memory sub-system, receives a second request from the host computer system for a configuration data associated with the memory sub-system, and responsive to receiving the second request from the host computer system before the back-end component has completed the second set of initialization operations, provides the configuration data to the host computer system.
Public/Granted literature
- US20230064014A1 FIRMWARE POWER UP SEQUENCING IN MEMORY SUB-SYSTEMS Public/Granted day:2023-03-02
Information query