Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16696274Application Date: 2019-11-26
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Publication No.: US11978580B2Publication Date: 2024-05-07
- Inventor: Kazuya Tobita , Yuto Shiga , Youichi Kazuta , Noriaki Hamachi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 18225351 2018.11.30
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/34 ; H01F27/32

Abstract:
A first dimension of each of a first connection portion 12 and a second connection portion 14 in the direction in which a pair of side surfaces 2e and 2f face each other is smaller than an inner diameter W2 of a coil 8 in the direction and is larger than a width W1 of each of a plurality of coil conductors in the direction. A second dimension of each of the first connection portion 12 and the second connection portion 14 in the direction in which a pair of main surfaces 2c and 2d face each other is larger than a thickness H1 of each of the plurality of coil conductors in the direction and is smaller than a height H2 of the coil 8 in the direction.
Public/Granted literature
- US20200176173A1 MULTILAYER COIL COMPONENT Public/Granted day:2020-06-04
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