Invention Grant
- Patent Title: Capacitor component including through-hole structure to increase capacitance
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Application No.: US17712424Application Date: 2022-04-04
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Publication No.: US11978595B2Publication Date: 2024-05-07
- Inventor: Sang Jong Lee , Su Bong Jang , Min Cheol Park , Tae Ho Yun , Han Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20210180299 2021.12.16
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G4/232 ; H01G4/30

Abstract:
A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.
Public/Granted literature
- US20230197347A1 CAPACITOR COMPONENT Public/Granted day:2023-06-22
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