Invention Grant
- Patent Title: Systems and methods for wafer pod alignment
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Application No.: US17883572Application Date: 2022-08-08
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Publication No.: US11978653B2Publication Date: 2024-05-07
- Inventor: Chao-Hsiang Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- The original application number of the division: US15883509 2018.01.30
- Main IPC: H01L21/68
- IPC: H01L21/68 ; B25J11/00 ; H01L21/67 ; B25J9/16 ; H01L21/673

Abstract:
In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
Public/Granted literature
- US20220384232A1 SYSTEMS AND METHODS FOR WAFER POD ALIGNMENT Public/Granted day:2022-12-01
Information query
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