Invention Grant
- Patent Title: Substrate with cut semiconductor pieces having measurement test structures for semiconductor metrology
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Application No.: US17306058Application Date: 2021-05-03
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Publication No.: US11978679B2Publication Date: 2024-05-07
- Inventor: Chen Dror
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Huse IP Law
- Agent Charles C. Huse
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G05B19/418 ; H01L21/66 ; H01L23/544
Abstract:
A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective instance of a measurement test structure and an alignment mark. Each piece of the plurality of pieces has a known location from the one or more semiconductor wafers.
Public/Granted literature
- US20210351089A1 Substrate with Cut Semiconductor Pieces Having Measurement Test Structures for Semiconductor Metrology Public/Granted day:2021-11-11
Information query
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