- Patent Title: Package, and method for manufacturing power semiconductor module
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Application No.: US17455719Application Date: 2021-11-19
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Publication No.: US11978682B2Publication Date: 2024-05-07
- Inventor: Yoshio Tsukiyama , Akiyoshi Osakada , Teppei Yamaguchi
- Applicant: NGK Electronics Devices, Inc. , NGK Insulators, Ltd.
- Applicant Address: JP Mine
- Assignee: NGK ELECTRONICS DEVICES, INC.,NGK INSULATORS, LTD.
- Current Assignee: NGK ELECTRONICS DEVICES, INC.,NGK INSULATORS, LTD.
- Current Assignee Address: JP Mine; JP Nagoya
- Agency: BURR PATENT LAW, PLLC
- Priority: JP 19117407 2019.06.25
- Main IPC: H01L23/047
- IPC: H01L23/047 ; H01L21/52 ; H01L23/36 ; H01L23/495 ; H01L23/00

Abstract:
A first frame is supported by a heat sink plate, surrounds an unmounted region of the heat sink plate, contains a resin, and has a first surface. A second frame contains a resin, and has a second surface opposing the first surface. An external terminal electrode passes between the first surface and the second surface. An adhesive layer contains a resin, and includes a lower portion, an upper portion, and an intermediate portion. The lower portion connects the external terminal electrode and the first surface to each other. The upper portion connects the external terminal electrode and the second surface to each other. The intermediate portion is disposed within a through hole of the external terminal electrode, and connects the lower portion and the upper portion to each other.
Public/Granted literature
- US20220077011A1 PACKAGE, AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR MODULE Public/Granted day:2022-03-10
Information query
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