Invention Grant
- Patent Title: Chip or system-in-package protection using the GMI effect
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Application No.: US17304258Application Date: 2021-06-17
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Publication No.: US11978708B2Publication Date: 2024-05-07
- Inventor: Thibaut Sohier , Stephan Borel , Jean-Philippe Michel , Gilles Simon
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR 06442 2020.06.19
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G06F21/87

Abstract:
Device of the chip or electronic system-in-package type, comprising at least one element for protecting at least part of at least one face of the device, said protective element comprising at least:
an attack detection element of the device comprising at least one GMI-effect electrically conductive material, and
a magnetic field emitter to which said GMI-effect electrically conductive material is to be subjected,
and wherein the GMI effect is to be achieved in said GMI-effect electrically conductive material when an exciting alternating electric current flows therethrough and when subjected to the magnetic field of the magnetic field emitter.
an attack detection element of the device comprising at least one GMI-effect electrically conductive material, and
a magnetic field emitter to which said GMI-effect electrically conductive material is to be subjected,
and wherein the GMI effect is to be achieved in said GMI-effect electrically conductive material when an exciting alternating electric current flows therethrough and when subjected to the magnetic field of the magnetic field emitter.
Public/Granted literature
- US20210398918A1 CHIP OR SYSTEM-IN-PACKAGE PROTECTION USING THE GMI EFFECT Public/Granted day:2021-12-23
Information query
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