Invention Grant
- Patent Title: Solder ball application for singular die
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Application No.: US18048513Application Date: 2022-10-21
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Publication No.: US11978711B2Publication Date: 2024-05-07
- Inventor: Erick Merle Spory
- Applicant: Global Circuit Innovations Inc.
- Applicant Address: US CO Colorado Springs
- Assignee: Global Circuit Innovations Incorporated
- Current Assignee: Global Circuit Innovations Incorporated
- Current Assignee Address: US CO Colorado Springs
- Agent Thomas J. Lavan
- The original application number of the division: US17097162 2020.11.13
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A device is provided. The device includes one or more of a singular die, one of another die, a printed circuit board, and a substrate, and one or more solder balls. The singular die includes one or more reconditioned die pads, which include die pads of the singular die with a plurality of metallic layers applied. The other die, printed circuit board, and the substrate include one or more bond pads. The one or more solder balls are between the one or more reconditioned die pads and the one or more bond pads.
Public/Granted literature
- US20230055518A1 Solder Ball Application for Singular Die Public/Granted day:2023-02-23
Information query
IPC分类:
