Invention Grant
- Patent Title: Method of forming semiconductor package transmission lines with micro-bump lines
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Application No.: US17098602Application Date: 2020-11-16
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Publication No.: US11978712B2Publication Date: 2024-05-07
- Inventor: Chin-Wei Kuo , Hsiao-Tsung Yen , Min-Chie Jeng , Yu-Ling Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US14875448 2015.10.05
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/367 ; H01L23/495 ; H01L23/498 ; H01L23/522 ; H01L23/525 ; H01L23/528 ; H01L23/532 ; H01L23/66 ; H01L25/065 ; H01P5/02
Abstract:
Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.
Public/Granted literature
- US20210082848A1 Methods and Apparatus for Transmission Lines in Packages Public/Granted day:2021-03-18
Information query
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