A semiconductor manufacturing apparatus includes a stage capable of holding thereon an interconnection substrate. A tool presses the interconnection substrate and a semiconductor chip against each other between the tool and the stage. The tool includes a main body portion that has a holding surface holding thereon the semiconductor chip. A first protruding portion is provided along an outer edge of the holding surface and protrudes from the holding surface toward the stage. A second protruding portion is provided outside of the first protruding portion along the outer edge of the holding surface and protrudes from the holding surface toward the stage. A groove portion is provided between the first protruding portion and the second protruding portion.