Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17663202Application Date: 2022-05-12
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Publication No.: US11978769B2Publication Date: 2024-05-07
- Inventor: Kwang-Young Lee , Jin Wook Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20190106973 2019.08.30
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/768 ; H01L21/8234 ; H01L29/417 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a source/drain pattern disposed on a substrate and a source/drain contact connected to the source/drain pattern. The source/drain contact includes a lower contact structure extending in a first direction and an upper contact structure protruding from the lower contact structure. The upper contact structure includes a first sidewall and a second sidewall facing away from each other in the first direction. The first sidewall of the upper contact structure includes a plurality of first sub-sidewalls, and each of the first sub-sidewalls includes a concave surface.
Public/Granted literature
- US20220271123A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-08-25
Information query
IPC分类: