Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17580847Application Date: 2022-01-21
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Publication No.: US11978779B2Publication Date: 2024-05-07
- Inventor: Juyoun Kim , Hyung Jong Lee , Seulgi Yun , Seki Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Fish & Richardson P.C.
- Priority: KR 20210035442 2021.03.18 KR 20210052673 2021.04.22
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/092

Abstract:
A semiconductor device includes a first active pattern on a substrate. The first active pattern includes a pair of first source/drain patterns and a first channel pattern therebetween. A gate electrode is disposed on the first channel pattern, and a first gate spacer is disposed on a side surface of the gate electrode. The first gate spacer includes a first spacer and a second spacer. A top surface of the first spacer is lower than a top surface of the second spacer. A first blocking pattern is disposed on the first spacer, and a gate contact is coupled to the gate electrode. The first blocking pattern is interposed between the gate contact and the second spacer.
Public/Granted literature
- US20220302274A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-09-22
Information query
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