Invention Grant
- Patent Title: FinFET devices and methods of forming the same
-
Application No.: US16218493Application Date: 2018-12-13
-
Publication No.: US11978802B2Publication Date: 2024-05-07
- Inventor: Chung-Wei Hsu , Chih-Hao Wang , Huan-Chieh Su , Wei-Hao Wu , Zhi-Chang Lin , Jia-Ni Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/28 ; H01L21/768 ; H01L29/423 ; H01L29/49 ; H01L29/51 ; H01L29/66

Abstract:
Provided are FinFET devices and methods of forming the same. A dummy gate having gate spacers on opposing sidewalls thereof is formed over a substrate. A dielectric layer is formed around the dummy gate. An upper portion of the dummy gate is removed and upper portions of the gate spacers are removed, so as to form a first opening in the dielectric layer. A lower portion of the dummy gate is removed to form a second opening below the first opening. A metal layer is formed in the first and second openings. The metal layer is partially removed to form a metal gate.
Public/Granted literature
- US20200044086A1 FINFET DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2020-02-06
Information query
IPC分类: