Invention Grant
- Patent Title: Display module and method for molding display module
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Application No.: US17982229Application Date: 2022-11-07
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Publication No.: US11978836B2Publication Date: 2024-05-07
- Inventor: Taehyeun Ha , Jaehoo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR 20190053619 2019.05.08
- The original application number of the division: US16869719 2020.05.08
- Main IPC: H01L33/54
- IPC: H01L33/54 ; B29C45/14 ; B29C45/16 ; B29L31/34 ; H01L25/075

Abstract:
A display module is provided that includes a substrate and a molding part. The substrate includes a first surface disposed with a plurality of LEDs, and a second surface, opposite of the first surface, that is disposed with a plurality of chips connected to the plurality of LEDs and further disposed with a coupling body. The molding part covers the first surface and the plurality of LEDs, and has a shape corresponding to a shape of the plurality of LEDs.
Public/Granted literature
- US20230054995A1 DISPLAY MODULE AND METHOD FOR MOLDING DISPLAY MODULE Public/Granted day:2023-02-23
Information query
IPC分类: