Invention Grant
- Patent Title: Light emitting diode package
-
Application No.: US17724864Application Date: 2022-04-20
-
Publication No.: US11978837B2Publication Date: 2024-05-07
- Inventor: Seung Ri Choi , Hyuck Jun Kim , Se Min Bang , Do Choul Woo , Se Won Tae
- Applicant: SEOUL SEMICONDUCTOR CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: SEOUL SEMICONDUCTOR CO., LTD.
- Current Assignee: SEOUL SEMICONDUCTOR CO., LTD.
- Current Assignee Address: KR Ansan-si
- Agency: Perkins Coie LLP
- Priority: KR 20170105644 2017.08.21 KR 20180004648 2018.01.12
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L25/075 ; H01L33/36 ; H01L33/48 ; H01L33/50 ; H01L33/54 ; H01L33/60 ; H01L33/62 ; H01L33/64

Abstract:
A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.
Public/Granted literature
- US20220246808A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2022-08-04
Information query
IPC分类: