Invention Grant
- Patent Title: Printed circuit board
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Application No.: US17934819Application Date: 2022-09-23
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Publication No.: US11979985B2Publication Date: 2024-05-07
- Inventor: Won Suk Jung
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR 20180158282 2018.12.10
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H05K1/18

Abstract:
A printed circuit board according to an embodiment includes: a first insulating portion having a cavity; a second insulating portion disposed on the first insulating portion; a third insulating portion disposed under the first insulating portion; and an electronic device disposed in the cavity, wherein a number of layers of the second insulating portion is different from a number of layers of the third insulating portion, and has an asymmetric structure with respect to the first insulating portion in which the electronic device is disposed.
Public/Granted literature
- US20230016067A1 PRINTED CIRCUIT BOARD Public/Granted day:2023-01-19
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