Invention Grant
- Patent Title: Fine silicon particles and production method thereof
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Application No.: US17783199Application Date: 2020-12-02
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Publication No.: US11981574B2Publication Date: 2024-05-14
- Inventor: Yoshinobu Nakada , Naoki Rikita
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP 19223082 2019.12.10
- International Application: PCT/JP2020/044776 2020.12.02
- International Announcement: WO2021/117567A 2021.06.17
- Date entered country: 2022-06-07
- Main IPC: C01B33/02
- IPC: C01B33/02 ; B02C17/04

Abstract:
The present invention provides a fine silicon powder and the like including fine silicon particles having a microscopically measured particle diameter of 1 μm or more and an average circularity determined in accordance with Formula (1) of 0.93 or more, in which an average particle diameter based on volume, which is measured by a laser diffraction scattering method, is in a range of 0.8 μm or more and 8.0 μm or less, an average particle diameter based on number, which is measured by the laser diffraction scattering method, is in a range of 0.100 μm or more and 0.150 μm or less, and a specific surface area, which is measured by a BET method, is in a range of 4.0 m2/g or more and 10 m2/g or less. Circularity=(4×π×projected area of particle)1/2/peripheral length of particle (1).
Public/Granted literature
- US20230025365A1 FINE SILICON PARTICLES AND PRODUCTION METHOD THEREOF Public/Granted day:2023-01-26
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