Invention Grant
- Patent Title: Thermally conductive pipe, heat treatment device, and treatment system
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Application No.: US17333030Application Date: 2021-05-28
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Publication No.: US11982493B2Publication Date: 2024-05-14
- Inventor: Toshiyuki Miyata , Toru Inoue , Kazuyoshi Itoh , Toko Hara , Keitaro Mori , Sou Morizaki , Motoharu Nakao , Kiyoshi Koyanagi
- Applicant: FUJIFILM Business Innovation Corp.
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee: FUJIFILM Business Innovation Corp.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 20211954 2020.12.22
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28F1/40

Abstract:
A thermally conductive pipe includes a pipe of which both end portions are closed, a working liquid that is sealed inside the pipe and vaporizes and liquefies, and a liquid transfer unit that exists along a longitudinal direction inside the pipe and transfers the liquefied working liquid at least in the longitudinal direction, in which the liquid transfer unit has, in a case of being viewed in a cross section of the pipe, which is orthogonal to the longitudinal direction, a first liquid transfer unit that is in contact with at least a partial range of an inner wall surface of the pipe and a second liquid transfer unit that is not in contact with the inner wall surface of the pipe and the first liquid transfer unit.
Public/Granted literature
- US20220196339A1 THERMALLY CONDUCTIVE PIPE, HEAT TREATMENT DEVICE, AND TREATMENT SYSTEM Public/Granted day:2022-06-23
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