Invention Grant
- Patent Title: Dielectric composition and multilayered electronic component comprising the same
-
Application No.: US17992469Application Date: 2022-11-22
-
Publication No.: US11984267B2Publication Date: 2024-05-14
- Inventor: Tae Young Ham , Ji Hong Jo , Seung In Baik , Hyung Soon Kwon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20190077574 2019.06.28
- Main IPC: H01G4/12
- IPC: H01G4/12 ; C04B35/468 ; H01G4/012 ; H01G4/248 ; H01G4/30

Abstract:
A dielectric composition includes a main ingredient having a perovskite structure represented by ABO3, where A is at least one of Ba, Sr, and Ca and B is at least one of Ti, Zr, and Hf, and a first accessory ingredient. The first accessory ingredient comprises 0.1 mole or more of a rare earth element, 0.02 mole or more of Nb, and 0.25 mole or more and 0.9 mole or less of Mg, a sum of contents of the rare earth element and Nb is 1.5 mole or less.
Public/Granted literature
- US20230082113A1 DIELECTRIC COMPOSITION AND MULTILAYERED ELECTRONIC COMPONENT COMPRISING THE SAME Public/Granted day:2023-03-16
Information query