Invention Grant
- Patent Title: Method of forming brass-coated metals in flip-chip redistribution layers
-
Application No.: US17884284Application Date: 2022-08-09
-
Publication No.: US11984418B2Publication Date: 2024-05-14
- Inventor: Vivek Swaminathan Sridharan , Christopher Daniel Manack , Nazila Dadvand , Salvatore Frank Pavone , Patrick Francis Thompson
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- The original application number of the division: US16721546 2019.12.19
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A method for manufacturing a package includes positioning a copper layer above a die. A zinc layer is positioned on the copper layer. The zinc and copper layers are then heated to produce a brass layer, the brass layer abutting the copper layer. Further, a polymer layer is positioned abutting the brass layer.
Public/Granted literature
- US20220384375A1 BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS Public/Granted day:2022-12-01
Information query
IPC分类:
