Invention Grant
- Patent Title: Image sensor and image sensing device
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Application No.: US17368112Application Date: 2021-07-06
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Publication No.: US11984467B2Publication Date: 2024-05-14
- Inventor: Dae Shik Kim , Min-Sun Keel , Sang Kil Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Fish & Richardson P.C.
- Priority: KR 20200144925 2020.11.03
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L25/065 ; H10B61/00

Abstract:
An image sensor includes an upper chip having a pixel array connected to a first connecting structure, and a lower chip below the upper chip and having a second connecting structure connected to the first connecting structure and having first and second stacked metal layers with a same thickness, a third metal layer on the second metal layer and thicker than the second metal layer, a fourth metal layer on the third metal layer and thicker than the third metal layer, first through third insulating layers alternating with the first through fourth metal layers, a first memory device with a first MTJ element in at least one of the first and second insulating layers, and a second memory device with a second MTJ element different from the first MTJ element, the second MTJ element being in at least one of the first through third insulating layers.
Public/Granted literature
- US20220139991A1 IMAGE SENSOR AND IMAGE SENSING DEVICE Public/Granted day:2022-05-05
Information query
IPC分类: