Invention Grant
- Patent Title: Buried grid with shield in wide band gap material
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Application No.: US18182621Application Date: 2023-03-13
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Publication No.: US11984474B2Publication Date: 2024-05-14
- Inventor: Hossein Elahipanah
- Applicant: II-VI Delaware, Inc.
- Applicant Address: US DE Wilmington
- Assignee: II-VI ADVANCED MATERIALS, LLC
- Current Assignee: II-VI ADVANCED MATERIALS, LLC
- Current Assignee Address: US NJ Pine Brook
- Agency: Blank Rome LLP
- Priority: SE 506014 2018.05.22
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/16 ; H01L29/20 ; H01L29/24 ; H01L29/40 ; H01L29/872

Abstract:
There is disclosed a structure in a wide band gap material such as silicon carbide wherein there is a buried grid and shields covering at least one middle point between two adjacent parts of the buried grid, when viewed from above. Advantages of the invention include easy manufacture without extra lithographic steps compared with standard manufacturing process, an improved trade-off between the current conduction and voltage blocking characteristics of a JBSD comprising the structure.
Public/Granted literature
- US20230215911A1 BURIED GRID WITH SHIELD IN WIDE BAND GAP MATERIAL Public/Granted day:2023-07-06
Information query
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