Invention Grant
- Patent Title: Method of embedding low-k materials in antennas
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Application No.: US17360242Application Date: 2021-06-28
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Publication No.: US11984668B2Publication Date: 2024-05-14
- Inventor: Monsen Liu , Lai Wei Chih , Chung-Hao Tsai , Jeng-Shien Hsieh , En-Hsiang Yeh , Chuei-Tang Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16390427 2019.04.22
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01L21/56 ; H01L23/00 ; H01Q1/38
Abstract:
A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module.
Public/Granted literature
- US20210328347A1 Embedding Low-K Materials in Antennas Public/Granted day:2021-10-21
Information query
