Invention Grant
- Patent Title: Temperature compensation circuit and phased array apparatus
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Application No.: US17242525Application Date: 2021-04-28
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Publication No.: US11984915B2Publication Date: 2024-05-14
- Inventor: Junwei Hu , Rong Peng
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: HUAWEI TECHNOLOGIES CO., LTD.
- Main IPC: H01Q23/00
- IPC: H01Q23/00 ; H01Q21/06 ; H04B1/036

Abstract:
Example temperature compensation circuits and a phased array apparatus are described. One example temperature compensation circuit is applied to a signal processing path. The example temperature compensation circuit includes a temperature detection circuit, a temperature conversion circuit, and a passive variable attenuator. The passive variable attenuator is configured to be connected in series in the signal processing path. The temperature detection circuit is configured to generate a temperature signal and a reference signal, and output the temperature signal and the reference signal to the temperature conversion circuit. The temperature signal monotonically changes with a temperature of the signal processing path. The temperature conversion circuit is configured to generate a control signal based on the temperature signal and the reference signal. The passive variable attenuator is configured to adjust, under control of the control signal, an attenuation value of a signal processed by the signal processing path.
Public/Granted literature
- US20210249790A1 TEMPERATURE COMPENSATION CIRCUIT AND PHASED ARRAY APPARATUS Public/Granted day:2021-08-12
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