Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US18179400Application Date: 2023-03-07
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Publication No.: US11984920B2Publication Date: 2024-05-14
- Inventor: Daisuke Yoshida
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: XSENSUS LLP
- Priority: JP 20113420 2020.06.30
- Main IPC: H04B1/16
- IPC: H04B1/16 ; H03F3/195 ; H04B1/00 ; H04B1/40 ; H04B1/44 ; H04B1/04

Abstract:
A radio-frequency module includes an integrated circuit (IC) device and an external inductor provided outside the IC device. The IC device includes a plurality of low-noise amplifiers, one or more inductors, and a switching circuit. The plurality of low-noise amplifiers includes a plurality of transistors in one to one correspondence. The one or more inductors are coupled to one or more of the plurality of transistors. Each inductor is coupled to the emitter or source of a corresponding one of the plurality of transistors. The switching circuit is coupled between the emitter or source of each of the plurality of transistors and the external inductor. The external inductor is coupled between the switching circuit and ground in series with each of the one or more inductors via the switching circuit.
Public/Granted literature
- US20230208462A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2023-06-29
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