Invention Grant
- Patent Title: Printed circuit board assembly
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Application No.: US17372032Application Date: 2021-07-09
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Publication No.: US11985757B2Publication Date: 2024-05-14
- Inventor: Won Wook So , Doo Il Kim , Young Sik Hur
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190049696 2019.04.29
- The original application number of the division: US16566217 2019.09.10
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/36 ; H01L23/538 ; H01L23/552 ; H01L23/66 ; H01Q1/38 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/00

Abstract:
A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.
Public/Granted literature
- US20210337652A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2021-10-28
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