Invention Grant
- Patent Title: Flexible laminated board and multilayer circuit board
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Application No.: US17157695Application Date: 2021-01-25
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Publication No.: US11985762B2Publication Date: 2024-05-14
- Inventor: Eisuke Tachibana , Taro Suzuki , Makoto Totani , Kouji Kondoh , Eijirou Miyagawa , Junya Kasahara , Takao Arima
- Applicant: UBE EXSYMO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: UBE EXSYMO CO., LTD.
- Current Assignee: UBE EXSYMO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Carstens, Allen & Gourley, LLP
- Agent J. Miguel Hernandez; James R. Gourley
- Priority: JP 15004337 2015.01.13 JP 15004338 2015.01.13
- The original application number of the division: US15541630
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B29C43/48 ; B29C48/88 ; B32B3/08 ; B32B7/04 ; B32B7/06 ; B32B15/088 ; B32B15/09 ; B32B15/098 ; B32B15/18 ; B32B15/20 ; B32B27/28 ; B32B27/36 ; B32B27/42 ; B32B37/06 ; B32B37/08 ; B32B37/10 ; H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K3/02 ; H05K3/46 ; B65G15/12 ; H05K3/06 ; H05K3/22

Abstract:
A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.
Public/Granted literature
- US20210153348A1 FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD Public/Granted day:2021-05-20
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