An apparatus and system for temperature mitigation and, more particularly, a flexible heat spreader attachment that flexibly attaches to the periphery of a circuit board, allowing for its use with numerous circuit board shapes and sizes, including those of irregular shapes and sizes. The flexible heat spreader attachment includes a base plate, a heat spreader attached to the base plate, and four adjustable arms attached to the base plate, wherein each of the adjustable arms include circuit board hooks configured to attach to the periphery of a circuit board and maintain the heat spreader at a desired location on, and spaced from, the circuit board.