- Patent Title: Encapsulation structure, encapsulation method and display apparatus
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Application No.: US16642667Application Date: 2019-08-16
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Publication No.: US11985845B2Publication Date: 2024-05-14
- Inventor: Chengjie Qin , Tao Wang , Song Zhang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Lippes Mathias LLP
- Priority: CN 1810962401.3 2018.08.22
- International Application: PCT/CN2019/101146 2019.08.16
- International Announcement: WO2020/038301A 2020.02.27
- Date entered country: 2020-02-27
- Main IPC: H10K50/844
- IPC: H10K50/844 ; H10K71/00 ; H10K102/00

Abstract:
The present disclosure discloses an encapsulation structure, an encapsulation method and a display apparatus. The encapsulation structure includes at least two encapsulation structure layers that cover an outer side of a device to be encapsulated, at least one of the at least two encapsulation structure layers includes an inorganic layer and an organic layer that are superimposed. The inorganic layer comprises a first sub-inorganic layer and a second sub-inorganic layer that are superimposed, a first opening is in the first sub-inorganic layer, a second opening is in the second sub-inorganic layer, and an elastic structure is disposed in each of the first opening and the second opening.
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