Invention Grant
- Patent Title: Cutting device
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Application No.: US17535006Application Date: 2021-11-24
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Publication No.: US11986971B2Publication Date: 2024-05-21
- Inventor: Kentaro Sugiyama , Yoshinori Nakamura , Tomoyasu Niizeki
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya
- Agency: K&L Gates LLP
- Priority: JP 17070014 2017.03.31
- Main IPC: B26D5/06
- IPC: B26D5/06 ; B26D5/00 ; B26D7/26

Abstract:
A cutting device includes a platen, a mounting portion, a first movement mechanism, a second movement mechanism, a detector, a processor, and a memory. The memory is configured to store computer-readable instructions that, when executed by the processor, instruct the processor to perform processes. The processes include acquiring cutting data, acquiring a contact position output by the detector when the cutting blade comes into contact with the holding member, and controlling the first movement mechanism in accordance with the cutting data to move the mounting portion and the holding member to a cutting start position. The processes include controlling the second movement mechanism, at the cutting start position, to move the mounting portion in the third direction to a cutting position set on the basis of the contact position, and controlling the first movement mechanism in accordance with the acquired cutting data to perform cutting processing.
Public/Granted literature
- US20220080611A1 CUTTING DEVICE Public/Granted day:2022-03-17
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