A substrate processing apparatus for separating an electronic component from a substrate with the electronic component attached to an upper surface includes an upper surface processing device that separates the electronic component from the upper surface of the substrate. The upper surface processing device has an upper surface processing transporter that transports the substrate from an upstream side to a downstream side and an upper surface rotary blade that separates the electronic component from the upper surface of the substrate. The upper surface processing transporter has a sixth belt conveyor on the upstream side and a seventh belt conveyor on the downstream side, the sixth and seventh belt conveyors being located below the upper surface rotary blade and aligned in a transport direction. The upper surface rotary blade has a downstream portion facing a gap between the sixth belt conveyor and the seventh belt conveyor.