Invention Grant
- Patent Title: Wood-grained polymer substrate
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Application No.: US17505091Application Date: 2021-10-19
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Publication No.: US11986990B2Publication Date: 2024-05-21
- Inventor: Andrew Stephens , Francisco Morales , Tadeusz Rybka
- Applicant: Tangent Technologies LLC
- Applicant Address: US IL Aurora
- Assignee: TANGENT TECHNOLOGIES LLC
- Current Assignee: TANGENT TECHNOLOGIES LLC
- Current Assignee Address: US IL Aurora
- Agency: McDermott Will & Emery LLP
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B29C48/18 ; B29C48/49 ; B29C48/695 ; B32B3/26 ; B32B27/20 ; B32B27/32 ; B29K23/00 ; B29L31/10
Abstract:
A wood-grained polymer substrate includes a plurality of layers of different colors. The substrate is formed into elongated boards and used in the production of various end products similar to natural wood. Methods for producing the wood-grained polymer substrate are also provided.
Public/Granted literature
- US20220032526A1 WOOD-GRAINED POLYMER SUBSTRATE Public/Granted day:2022-02-03
Information query
