Invention Grant
- Patent Title: Systems and methods for evacuated injection repair of bondline voids
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Application No.: US17551320Application Date: 2021-12-15
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Publication No.: US11987015B2Publication Date: 2024-05-21
- Inventor: Joseph L. Hafenrichter , Gary E. Georgeson , Marc J. Piehl
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US VA Arlington
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Main IPC: B29C73/02
- IPC: B29C73/02 ; B29C73/24 ; B29L31/30
Abstract:
In an example, a method is described. The method comprises forming a single hole into a bond gap repair area. The method also comprises evacuating, via an adhesive injection apparatus attached to the single hole, the bond gap repair area and an injection channel of the adhesive injection apparatus. The method also comprises forcing adhesive through the evacuated injection channel and into the evacuated bond gap repair area.
Public/Granted literature
- US20220194031A1 Systems And Methods For Evacuated Injection Repair Of Bondline Voids Public/Granted day:2022-06-23
Information query
