Invention Grant
- Patent Title: Resist underlayer composition, and method of forming patterns using the composition
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Application No.: US17147308Application Date: 2021-01-12
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Publication No.: US11987561B2Publication Date: 2024-05-21
- Inventor: Yoojeong Choi , Soonhyung Kwon , Hyeon Park , Jaeyeol Baek , Minsoo Kim , Shinhyo Bae , Daeseok Song , Dowon Ahn
- Applicant: Samsung SDI Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR 20200006770 2020.01.17
- Main IPC: C07D251/34
- IPC: C07D251/34 ; G03F7/004 ; G03F7/11 ; G03F7/16 ; G03F7/26
Abstract:
A resist underlayer composition includes (A) a polymer including a structural unit represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof; (B) a polymer including a structure in which at least one moiety represented by Chemical Formula 3 or Chemical Formula 4 and a moiety represented by Chemical Formula 7 are bound to each other; and (C) a solvent:
Public/Granted literature
- US20210230127A1 RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION Public/Granted day:2021-07-29
Information query
