Invention Grant
- Patent Title: Resin composition for plating
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Application No.: US17762478Application Date: 2021-10-28
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Publication No.: US11987698B2Publication Date: 2024-05-21
- Inventor: Shinji Yamashita , Hiroshi Sakai , Hideichiro Kawaguchi
- Applicant: Techno-UMG Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TECHNO-UMG CO., LTD.
- Current Assignee: TECHNO-UMG CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 20214083 2020.12.23
- International Application: PCT/JP2021/039917 2021.10.28
- International Announcement: WO2022/137801A 2022.06.30
- Date entered country: 2022-03-22
- Main IPC: C08L69/00
- IPC: C08L69/00 ; C08F279/04 ; C08L55/02 ; C23C18/20

Abstract:
The resin composition for plating of the present invention includes: a graft copolymer (A) in which a monomer component (a) including specific amounts of an aromatic vinyl compound (a1), a vinyl cyanide compound (a2), and another vinyl compound (a3) is graft-polymerized on a rubbery polymer; and a polycarbonate resin (P), wherein an amount of resin (P) is 40 to 70% by mass, based on a total mass of the resin composition, a rubber content (X) in copolymer (A) is more than 40% by mass, based on a total mass of copolymer (A), a graft ratio (Y) of copolymer (A) satisfies formula (1): 793e−0.041X≥Y≥515e−0.041X (1), and a rubber content (Z) in the resin composition is 10 to 18% by mass, based on a total mass of the resin composition.
Public/Granted literature
- US20220348764A1 RESIN COMPOSITION FOR PLATING Public/Granted day:2022-11-03
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