Invention Grant
- Patent Title: Cutting system and cutting device
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Application No.: US17702980Application Date: 2022-03-24
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Publication No.: US11987918B2Publication Date: 2024-05-21
- Inventor: Mayumi Nishizaki , Kanae Minamikawa , Yoko Yamanashi
- Applicant: BROTHER KOGYO KABUSHIKI KAISHA
- Applicant Address: JP Nagoya
- Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee: BROTHER KOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Nagoya
- Agency: K&L Gates LLP
- Priority: JP 21059064 2021.03.31
- Main IPC: D05B37/04
- IPC: D05B37/04 ; D05B19/10 ; D05C7/00

Abstract:
A cutting system includes a sewing machine and a cutting device. The sewing machine includes a sewing portion, a sewing communication portion, a sewing processor, and a sewing memory. The sewing machine acquires an embroidery data stored in the sewing memory. The sewing machine sends, via a network line, the acquired embroidery data. The cutting device includes a cutting portion, a cutter communication portion, a cutter processor, and a cutter memory. The cutting device receives, via the network line, the embroidery data sent by the sewing machine. The cutting device generates a cutting data based on the received embroidery data. The cutting device drives the cutting portion based on the generated cutting data, and cuts the object to be cut.
Public/Granted literature
- US20220316117A1 CUTTING SYSTEM AND CUTTING DEVICE Public/Granted day:2022-10-06
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